["27pcs stencils are as follows:\r\n1pc 1 universal stencil (P=1.5mm) 48mm×48mm\r\n1pc 0.25 universal stencil (P=0.5mm) 35mm×35mm\r\n2pcs 0.30 universal stencil (P=0.5mm) 30mm×30mm, 35mm×35mm\r\n2pcs 0.35 universal stencil (P=0.6mm) 30mm×30mm, 35mm×35mm\r\n1pc 0.40 universal stencil (P=0.78mm) 35mm×35mm\r\n1pc 0.45 universal stencil (P=0.78mm) 35mm×35mm\r\n3pcs 0.5 universal stencil (P=0.8mm) 31mm×31mm, 35mm×35mm, 0mm×40mm\r\n1pc 0.55 universal stencil (P=1.0mm) 50mm×50mm\r\n1pc 0.6 universal stencil (P=0.9mm) 45mm×45mm\r\n1pc 0.6 universal stencil (P=1.1mm) 32mm×32mm\r\n6pcs 0.6 universal stencil (P=1.0mm) 24mm×24mm, 27mm×27mm, 30mm×30mm, 33mm×33mm, 41mm×41mm, 45mm×45mm\r\n1pc 0.65 universal stencil (P=1.1mm) 47mm×47mm\r\n6pcs 0.76 universal stencil (P=1.27mm) 30mm×30mm, 33mm×33mm, 34mm×34mm, 37mm×37mm, 41mm×41mm, 55mm×55mm \r\n\r\nUniversal direct heat BGA stencils for notebooks, desktops, for , North and communications motherboards and other graphics cards and other types of BGA chip\r\n\r\nFeatures:\r\nMade of imported stainless steel plate. Good stencil thickness.\r\n\r\nCan be directly heated by air gun, steel mesh is not easy to deformation by heat.\r\nEach set of 27 pieces. Basically covers the current common BGA chip.\r\nSteel mesh area and BGA chip area matching, can reduce the waste of solder ball.\r\n\r\nBut for chip that solder balls uneven arranged or has different distance, please consider buying.\r\n\r\nNote:\r\nBetter solder ball has normal content of tin and silver. Melting point is normal.\r\nDirect heat with air gun, adjust the air gun temperature. No need too high temperature, otherwise cause deformation.\r\n\r\nPackage includes: (Without retail package)\r\n27 x Universal Stencils"]