Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temperature Strong Adhesion Maintenance Tin Paste for TV Mobile Phone Circuit Boards

RON54.00
+ RON22.49 Shipping
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Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temperature Strong Adhesion Maintenance Tin Paste for TV Mobile Phone Circuit Boards

Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temperature Strong Adhesion Maintenance Tin Paste for TV Mobile Phone Circuit Boards

  • Brand: Unbranded
Sold by:

Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temperature Strong Adhesion Maintenance Tin Paste for TV Mobile Phone Circuit Boards

  • Brand: Unbranded

RON54.00

Save RON15.00 (21%)

RRP

RON69.00
In stock
+ RON22.49 Shipping
Sold by:

RON54.00

Save RON15.00 (21%)

RRP

RON69.00
In stock
+ RON22.49 Shipping

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Description

Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temperature Strong Adhesion Maintenance Tin Paste for TV Mobile Phone Circuit Boards Item Type: Tin Solder Paste Material: Tin Paste Weight: Approx. 45g / 4.6oz (Range Deviation: 1-2g) Alloy: Sn96.5/Ag3/Cu0.5 Particle: 20-38μm
  • Brand: Unbranded
  • Category: Solder & Flux
  • Size: Normal
  • Colour: Solid
  • Fruugo ID: 394086206-842362481
  • EAN: 7901313601256

Delivery & Returns

Dispatched within 24 hours

  • EXPRESS: RON22.49 - Delivery by Tue 18 November 2025

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