Description 1. Made of high-purity, lead-free, environmentally friendly materials with low impurities and consistent composition, ensuring full and reliable solder joints. 2. Low melting point reduces thermal shock to components during soldering, offers high insulation resistance, stable performance, and safe operation. 3. Excellent wettability and spreadability, effectively preventing bridging and enabling fast, smooth tinning. 4. Provides efficient deoxidation and forms a protective oxide film on the solder joint surface, slowing further oxidation and maintaining bright, clean joints. 5. Advanced flux formulation produces minimal spatter, low smoke, and no odor during welding. 6. Leaves minimal residue, supports easy cleaning and assembly processes, with good feedability, neat winding, and smooth handling. 7. Suitable for use in electronic circuit assembly, computer motherboard repair, mobile phone soldering, aerospace industry PCB work, automated soldering machines, and DIY electronics projects. Specifications: - Color: As shown - Material: Copper-tin alloy - Wire diameter: 1.0 mm - Weight: 100g - Alloy composition (by weight): Sn99.3 Cu0.7 - Flux content: 2.2% ± 0.3% - Melting point range: 227°C - Halogen content: None - Density: 7.4 g/cm³ - Working temperature: 380 ± 20°C Package Includes: 1 x Solder Wire