Features: 1.Excellent Performance: Excellent thermal conductivity, upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds 2.Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module 3.Good Insulation: High temperature performance at ? 40 ? 200 will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation. Contact with any electrical trace will not cause any form of damage 4.Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand 5.Wide Range of Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis specification:Item Type: Thermal Pad Material: Silicone Thermal Conductivity: 13.8W/mk Density: 3.3 0.1 Hardness: 40-80Sc Breakdown Voltage: > 6KV / mm Temperature Resistance Range: - 40- 200 Size: Approx. 30 x 30 x 0.5mm / 1.2 x 1.2 x 0.02in Approx.30 x 30 x 1.0mm / 1.2 x 1.2 x 0.04in Approx. 30 x 30 x 1.5mm / 1.2 x 1.2 x 0.06in Approx. 30 x 30 x 2.0mm / 1.2 x 1.2 x 0.08in Approx. 30 x 30 x 2.5mm / 1.2 x 1.2 x 0.1in Approx. 30 x 30 x 3.0mm / 1.2 x 1.2 x 0.12in Compatible Devices: Laptop, Desktop PackageList:1 xThermal Pad